Well-known manufacturer of solutions for the memory company Micron has developed a new multichip housing (multi-chip package, MCP), where its experts managed to combine two types of high-density memory - NAND and DDR. The new MCP solution includes 34-nanometer NAND memory chip with one-level cell (SLC), as well as 50-nm dynamic memory with low power DDR (LPDDR). Moreover, if the density of the latter is equal to 2 Gbps, using the same flash memory of 4 Gb.
This development is considered the most advanced to date MCP product, which simultaneously uses two different types of memory - NAND and LPDDR. This decision will allow in the future easily increase storage capacity, and the use of it can be found in smartphones, portable media players and mobile Internet devices (MID). Micron has already started shipping the first samples of its new MCP products with 4 Gb and 2 Gb NAND LPDDR, and mass production of such chips should get started in early 2010.
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