Kingston is preparing new HyperX memory modules with support of water cooling

Thursday, December 24, 2009

The company Kingston Technology, known as one of the leading suppliers of solutions based on memory, decided to tease the enthusiast and published several photos of new DDR3 DIMM memory series HyperX. These modules are currently undergoing tests in laboratories, proprietary and probably will be available as early as next year.

In the photograph is clearly evident that the new memory modules series HyperX DDR3 DIMM can be attached to the system of liquid cooling. Obviously, this structural feature will also appeal to overclockers and enthusiasts, since it would allow to overclock the RAM to higher frequencies. In addition, the images can be seen that the new HyperX memory modules with support for water cooling works in tandem with the motherboard chipset X58. However, it is safe to assume that these modules are also compatible with systems based on chips in the performance of LGA 1156, and even AMD AM3.

No further details about the new memory modules, HyperX DDR3 DIMM series was not disclosed. Perhaps, Kingston Technology is going to present its new development at CES 2010, which will be held from 7 to 10 January in Las Vegas.