New professional body Antec LanBoy Air

Friday, December 25, 2009

Company Antec has announced a new model of the shell of a professional class LanBoy Air, designed to work in the gaming systems segment of the High-End and platforms with a maximum overclocking potential. Design LanBoy Air has a modular design with an open routing cooling air flows.

Corps LanBoy Air supports the installation of motherboards of most modern standards, including ATX, Micro-ATX, or Mini-ITX. Housing is equipped with nine compartments to install drives, including three external 5.25 "bays and six internal 3.5" bays. Each internal compartment equipped with special silicone grommets to minimize vibration. The system also supports eight expansion slots, which guarantees the support of modern configurations based on multiple graphics cards, including technology 3-Way SLI.

In order to give additional stability of the whole system, power supply is located in the bottom of the hull. Total cooling system components of the computer is built on the powerful 120 mm fan with blue LED illumination: one rear with intelligent technology and two front TriCool 120 mm with variable speed. Two additional internal 120 mm fan with TriCool technology and blue LED lighting designed specifically for cooling the graphics subsystem. When building the productive power of the system based on housing LanBoy Air are available seven seats for an additional 120 mm fans, two of which can be used for additional cooling of the processor, three are designed to dissipate heat from the drives, and two additional fans on the upper surface of the alignment contribute to the overall temperature balance the system.

Housing LanBoy Air equipped with a universal set of external interfaces, including two ports USB 2.0, port, eSATA, audio input and output with support for technologies AC'97 and HDA. Debut Antec LanBoy Air Corps will be held in the traditional international exhibition of consumer goods CES 2010 in Las Vegas, the beginning of the global supply of new items planned for the I quarter of 2010.