Thermaltake's next flagship CPU cooler exposed

Sunday, December 27, 2009

Company Thermaltake, known as a manufacturer of quality computer components, is preparing to be shown at the January 2010 CES, many new products. One of these items will surely become a new flagship CPU cooler, called the Frio.

New CPU cooler Thermaltake Frio is made in the form of a tower consisting of a set of aluminum fins with thickness of 0,05 mm. In addition, there are five U-shaped copper tubes teplootvodnyh 8 mm in diameter and 120 mm VR fan speed of rotation from 1200 to 2500 revolutions per minute.

Most likely, CPU cooler Thermaltake Frio supports interoperability with Intel LGA 775, 1156, 1366, as well as AMD chips as the structural AM2, AM2 +, AM3. For more information, obviously, will be available at CES 2010, which will open its doors on January 7.